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PCB Prototype and Production Specialists

Industry Leading Quality
Printed Circuit Boards
 
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FREE QUIK QUOTE

Our online Quik Quote system allows you to immediately price your order anytime;  Simply log on if you are an existing customer and provide us your specifications.  If you are new to our site, please register to create your personal account by pressing on the link below:

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DFM: DESIGN FOR MANUFACTURING

Circuits West is implementing this new automation tool as a way to streamline each step of the manufacturing process and ensure that your printed circuit boards are delivered to you accurately and efficiently.

Benefits to users:

  • Reduced Cost:  Helps identify design errors early and minimizes the need for more turns and costly corrections later.
  • Reduce Time:  Design a PCB more quickly by following pre-defined manufacturing guidelines
  • Process Simplification:  Eliminate guideline interpretations and potential manufacturing errors.
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CircuitsWest CAPABILITIES

CWI POLICIES AND SUPPORT

Thank you for considering us for your PCB needs.  Because Circuits West is committed to helping you meet your objectives, we want this part of the process to be as easy as possible.     In anticipation of potential needs, we’ve compiled these links to facilitate order placing.

CURRENT SPECIALS

 

Current PCB Specials

 

We're happy to announce NEW specials every month so please check with us frequently!
  • $59 per multi-layer, minimum 3 pieces.
  • Free Tooling and Test for one complete month to all new customers.
  • New Customer special:  50% discount on your first order!!
  • Quarterly Special: Random Drawing.  Get a chance to win with every order placed.

Click here for details!

PLACE AN ORDER

Thank you for the opportunity to serve you.  We can accept your order in four easy ways:  Phone, Fax, Email or right here and now online!

 Click here

PCB STANDARDS

STANDARD DEFAULT CRITERIA FOR PWB MATERIAL AND PROCESSING

NOTE: This is an uncontrolled document, and may be superseded without notice. To ensure that you have the latest revision, confer with your CWI customer contact.
  1. GENERAL NOTES:
    1. All criteria and values stated herein apply unless otherwise specified on customer drawings and/or specifications. Criteria and values not provided will meet the default requirements of IPC-6012, Table 1-1.
    2. Inspection and test criteria will be based upon IPC-A-600 and IPC-6012, Class 2.
    3. Multilayer layup configurations will represent balanced construction, selected from CWI standard designs.
    4. Rework: To the extent that product rework is necessary, the acceptance criteria will comply with IPC-7711, unless expressly stated otherwise by the customer.
  2. LAMINATE:
    1. Multilayer boards: FR-4 copper-clad glass-epoxy laminate (Type GFN) and multilayer bonding material (prepreg) per IPC-4101/21 with a minimum Tg of 140° C. Final multilayer substrate thickness to be 0.059" ±0.007". Starting clad copper weight to be 1 oz./ft² minimum on all internal layers and 0.5 oz./ft² minimum on external layers.
    2. Double sided plated-through boards: FR-4 glass epoxy laminate (Type GFN) per IPC-4101/21 with a minimum Tg of 110° C. Final substrate thickness to be 0.059" ±0.007". Starting clad copper weight to be 0.5 oz./ft² minimum.
    3. Non-plated through boards: FR-4 glass epoxy laminate (Type GFN) per IPC-4101/21 with a minimum Tg of 110° C. Final substrate thickness to be 0.059" ±0.007". Starting clad copper weight to be 1 oz./ft² minimum.
  3. MARKINGS:
    1. Vendor markings: Vendor identification and date code of manufacture will be printed or stamped on boards using non-conductive ink, or etched in copper.
    2. Component I.D.: When required, nomenclature will be printed on the component side of the board with white non-conductive epoxy ink or acrylate equivalent.
  4. PLATINGS AND COATINGS:
    1. Copper plating: Holes with lands on both sides are to be copper plated through. Copper plating thickness will be in accordance with IPC-6012, Class 3 (0.001" avg. minimum thickness). When lands on artwork are smaller or the same size as the corresponding finished holes, CWI will regard the hole as not requiring plating.
    2. Solderable coating: Copper features exposed by solder mask, except nickel/gold plated edge contacts, will be coated by hot air solder leveling (HASL), or a modified, white immersion tin (Omikron). CWI monitors the HASL and Omikron processes to ensure that boards meet the solderability requirements of J-STD-003, Category 2.
    3. Tin-Lead Reflow: The Printed Wiring Board industry is phasing out Tin-Lead Reflow because of environmental and cost concerns. CWI recommends that our customers consider the substitution of HASL or Omikron for Tin-Lead Reflow.
    4. Nickel/gold plated surfaces: For contact surfaces: a minimum thickness of 0.8µm gold over 2.5µm nickel; and for solderable surfaces, a maximum gold thickness of 0.8µm over a minimum thickness of 2.5µm nickel; per Table 3-2, Class 2, of IPC-6012.
  5. SOLDER MASK:
    1. Green liquid photoimageable solder mask (LPISM) will be applied over bare copper traces. The mask material will comply with IPC-SM-840 Type B, Class III. Unless specifically prohibited by the customer, CCI may occasionally substitute Dynachem Conformask© 2523 dry film solder mask for LPISM.
    2. LPISM and tented vias: Liquid photoimageable solder mask will not consistently cover tented vias. Vias that are covered by solder mask in the design will be plugged when agreed upon by CWI and the customer.
  6. DIMENSIONAL:
    1. Finished plated through hole size tolerances will be in accordance with IPC-D-300, Class B:
      1. Finished holes up to ø 0.032" -- ±0.003"
      2. Finished holes from ø 0.033" to ø 0.063" -- ±0.004"
      3. Finished holes from ø 0.064" and larger -- ±0.006"
    2. Dimensional tolerances, other than for hole sizes, will be in accordance with IPC-D-300, Class B.
    3. Bow and twist will not exceed 1% for boards bearing surface mount components, and 1.5% for all other boards.
    4. Unless otherwise specified, thickness tolerances will be ±10% of the finished board thickness, not including surface copper.


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